Contact Information
617-500-2518 (direct)
617-500-2499 (fax) devries@ORTpatent.com

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Materials Science
Nanotechnology
Semiconductors

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Frank R. Occhiuti

J. Robin Rohlicek, Ph.D.

Y. Rocky Tsao, Ph.D.

Mandy Jubang

Of Counsel, Associates, Technology Specialists, & Scientific Advisors

Mei Bai, Ph.D.

Y. Jenny Chen, Ph.D.

Gretchen A. DeVries, Ph.D.

Larry Y. Zhang, Ph.D.

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Gretchen A. DeVries, Ph.D.
Technology Specialist

Gretchen's practice focuses on patent prosecution in the areas of materials science, nanotechnology, and semiconductors.

Professional Experience
At MIT, Gretchen developed and characterized a method for the anisotropic assembly of metal nanoparticles. Her thesis was entitled "Divalent Metal Nanoparticles."

Gretchen also has experience at IBM and AMD, where she characterized and optimized various processing steps of integrated circuit fabrication. Her undergraduate research investigated the mechanical properties of microelectronic device packaging.

Education Ph.D., Materials Science & Engineering, Massachusetts Institute of Technology
B.S., Materials Science & Engineering, Stanford University, with distinction.

Languages
Proficient in Italian and Spanish

Publications
DeVries, G.A.; Carney, R.P.; Talley, F.R.; Stellacci, F. "Thermodynamic Study of the Reactivity of the Two Topological Point Defects Present in Mixed Self-Assembled Monolayers on Gold Nanoparticles." Advanced Materials 2008.

Carney, R.P.; DeVries, G.A.; Dubois, C.; Kin, H.; Kim, J.Y.; Singh, C.; Ghorai, P.K.; Tracy, J.B.; Stiles, R.L.; Murray, R.W.; Glotzer, S.C.; Stellacci, F. "Size Limitations for the Formation of Ordered Striped Nanoparticles." Journal of the American Chemical Society 2008, 130, 798-799.

DeVries, G.A.; Centrone, A.; Stellacci, F. "Chains of divalent gold nanoparticles." Proceedings of SPIE 2007, vol. 6768.

DeVries, G. A.; Brunnbauer, M.; Hu, Y.; Jackson, A. M.; Long, B.; Neltner, B. T.; Uzun, O.; Wunsch, B. H.; Stellacci, F. "Divalent Metal Nanoparticles." Science 2007, 315, 5810, 358-361.

Jenkins, M.; DeVries, G.A.; Dauskardt, R.H.; Bravman, J.C. "Studies of Silane Adhesion Promoters on Silica Filler Particles for use in Microelectronic Packaging." MRS Symposium Proceedings 2001, vol. 710, DD10.10.

Jenkins, M.; Snodgress, J.; Chesterman, A.; DeVries, G.A.; Dauskardt, R.H.; Bravman, J.C. "Adhesion Mechanisms of Silane Adhesion Promoters in Microelectronic Packaging." MRS Symposium Proceedings 2001, vol. 682E, N6.4.